Xinlian Integration reported 2025 revenue of RMB 8.18 billion (+25.67% YoY). Net loss narrowed 38.17% to RMB -595 million. The company leads in MEMS and power device wafer foundry plus module packaging, offering one‑stop system solutions.
Key strengths:
3rd‑gen MEMS microphones mass‑produced for premium consumer & EVs; 4th gen in iteration
Multi‑axis MEMS inertial sensors (automotive & consumer) in volume production
Automotive LiDAR VCSEL chips mass‑produced
Ranked global top 10 dedicated wafer foundry, 4th in mainland China
Global MEMS foundry #5 (Yole 2025) – the only mainland China player in top 5
Largest auto‑grade IGBT base in China; SiC MOSFET shipments top in Asia; first to mass‑produce 8‑inch SiC for main drive
High‑voltage BCD platform at international leading level, mass production
Capacity: 2.5127 million wafers (8‑inch equiv.) +24.68%, covering 8‑inch / 12‑inch Si and 6/8‑inch SiC
>50% market share in high‑end phone MEMS microphones for top global OEMs; consumer MEMS IMU qualified by leading phone brands
Strategic roadmap: from discrete devices to system‑level foundry solutions for automotive, AI, industrial and high‑end consumer.
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